Semiconductor package including a redistribution substrate and a method of fabricating the same

A semiconductor package, comprising:

• a package substrate;
• a first re-distribution layer disposed on the package substrate;
• a second re-distribution layer disposed between the package substrate and the first re-distribution layer;
• a first semiconductor chip mounted on a top surface of the first re-distribution layer;
• a first connection chip mounted on a bottom surface, opposite to the top surface, of the first re-distribution layer;
• a second connection chip mounted on a top surface of the second re-distribution layer;
• a first lower semiconductor chip mounted on a bottom surface, opposite to the top surface, of the second re-distribution layer and disposed between the package substrate and the second re-distribution layer;
• and
• an adhesive pattern interposed between the first connection chip and the second connection chip.

A semiconductor package, comprising:

• a package substrate;
• a first re-distribution layer disposed on the package substrate;
• a second re-distribution layer disposed between the package substrate and the first re-distribution layer;
• a connection substrate interposed between the first re-distribution layer and the second re-distribution layer, wherein a connection hole penetrates the connection substrate;
• a first semiconductor chip mounted on a first surface of the first re-distribution layer;
• a second semiconductor chip mounted on the first surface of the first re-distribution layer and spaced apart from the first semiconductor chip;
• a first connection chip mounted on a second surface, opposite to first surface, of the first re-distribution layer and disposed in the connection hole;
• a second connection chip mounted on a first surface of the second re-distribution layer and disposed in the connection hole;
• a substrate under-fill layer interposed between the package substrate and the second re-distribution layer;
• a first lower semiconductor chip mounted on a second surface, opposite to the first surface, of the second re-distribution layer and disposed in the substrate under-fill layer;
• and
• a second lower semiconductor chip mounted on the second surface of the second re-distribution layer and spaced apart from the first lower semiconductor chip.