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US 11,961,791 B2Granted
Package structures and methods for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChing-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo
Life of this patent
Estimating the term…
Abstract
A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.
Claims20
A device comprising:
- a bottom package comprising:
- a redistribution line comprising:
- an upper portion comprising a first top surface;
- a lower portion continuously connected to the upper portion, wherein the lower portion comprises a second top surface lower than the first top surface;
- and
- a device die over and bonding to the upper portion of the redistribution line;
- a solder region;
- and
- a top package over and bonded to the lower portion of the redistribution line through the solder region.
6 more elements
A device comprising:
- a bottom package comprising:
- a redistribution line comprising:
- a lower portion forming a first recess and a second recess, wherein the lower portion of the redistribution line comprises a first portion underlying the first recess, and second portions forming sidewalls of the first recess;
- and
- an upper portion connecting to a top end of the lower portion;
- an encapsulant over the redistribution line, wherein the encapsulant comprises a planar top surface, and wherein the encapsulant fills the second recess;
- a first solder region extending into the first recess;
- a second solder region over and joined to the upper portion of the redistribution line;
- and
- a die over and bonded to the second solder region;
- and
- a top package bonded to the first solder region.
9 more elements
A device comprising:
- a bottom package comprising:
- a redistribution line formed of a non-solder conductive material, wherein the redistribution line forms a recess, and wherein the redistribution line comprises:
- a first portion comprising:
- a bottom portion underlying the recess;
- and
- sidewall portions forming sidewalls of the recess;
- a second portion higher than the first portion;
- and
- a polymer region molded over and in physical contact with both of the first portion and the second portion of the redistribution line;
- a device die bonded to the second portion of the redistribution line;
- and
- a top package bonded to the redistribution line.
9 more elements
Dependencies are inferred from the claim text.