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US 11,961,784 B2Granted
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsArata Iizuka, Korehide Okamoto, Ryoya Shirahama
Life of this patent
Estimating the term…
Abstract
A first heat sink has a first inner surface and a first outer surface, and has a first through hole. A second heat sink has a second inner surface disposed with a clearance left from the first inner surface of the first heat sink, and a second outer surface opposite to the second inner surface, and has a second through hole. A semiconductor element is disposed within a clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink. A sealing member seals the semiconductor element within the clearance between the first inner surface and the second inner surface. A first hollow tube is made of metal, and connects the first through hole and the second through hole.
Claims20
A semiconductor device comprising:
- a first heat sink that has a first inner surface and a first outer surface opposite to the first inner surface, and has a first through hole between the first inner surface and the first outer surface;
- a second heat sink that has a second inner surface disposed with a clearance left from the first inner surface of the first heat sink, and a second outer surface opposite to the second inner surface, and has a second through hole between the second inner surface and the second outer surface;
- plural semiconductor elements disposed within the clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink;
- a sealing member that seals the semiconductor element within the clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink;
- and
- a first hollow tube that provides a passage for cooling water between the first and second heat sinks, is made of metal, and connects, through the sealing member, the first through hole of the first heat sink and the second through hole of the second heat sink, wherein
- the first hollow tube is positioned between the plural semiconductor elements.
4 more elements
A semiconductor device comprising
- a first heat sink that has a first inner surface and a first outer surface opposite to the first inner surface, and has a first through hole between the first inner surface and the first outer surface;
- a second heat sink that has a second inner surface disposed with a clearance left from the first inner surface of the first heat sink, and a second outer surface opposite to the second inner surface, and has a second through hole between the second inner surface and the second outer surface;
- a semiconductor element disposed within the clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink;
- a sealing member that seals the semiconductor element within the clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink;
- a first hollow tube that is made of metal and connects the first through hole of the first heat sink and the second through hole of the second heat sink;
- a first water cooling jacket that has a first space connected to the first through hole of the first heat sink;
- a second water cooling jacket that has a second space connected to the second through hole of the second heat sink;
- a bolt that presses the second water cooling jacket toward the first water cooling jacket;
- and
- a case through which the bolt passes.
7 more elements
A semiconductor device comprising:
- a first heat sink that has a first inner surface and a first outer surface opposite to the first inner surface, and has a first through hole between the first inner surface and the first outer surface;
- a second heat sink that has a second inner surface disposed with a clearance left from the first inner surface of the first heat sink, and a second outer surface opposite to the second inner surface, and has a second through hole between the second inner surface and the second outer surface;
- a semiconductor element disposed within the clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink;
- a sealing member that seals the semiconductor element within the clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink;
- and
- a first hollow tube that is made of metal and connects the first through hole of the first heat sink and the second through hole of the second heat sink, wherein:
- the first heat sink has a third through hole between the first inner surface and the first outer surface;
- and
- the second heat sink has a fourth through hole between the second inner surface and the second outer surface,
- the semiconductor device further comprising:
- a second hollow tube that is made of metal and connects the third through hole of the first heat sink and the fourth through hole of the second heat sink;
- a first water cooling jacket that has a first space connected to the first through hole of the first heat sink, and a third space connected to the third through hole of the first heat sink, and separates the first space from the third space;
- and
- a second water cooling jacket that has a second space connected to the second through hole of the second heat sink.
11 more elements
Dependencies are inferred from the claim text.