Semiconductor apparatus and electronic apparatus
AssigneeSony Semiconductor Solutions Corporation
InventorHitoshi Okano
Life of this patent
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Abstract
To provide a semiconductor apparatus that makes it possible to further improve the efficiency in heat dissipation, and to provide an electronic apparatus that includes the semiconductor apparatus. A semiconductor apparatus is provided that includes a substrate, a plurality of chips each stacked on the substrate, and a plurality of guard rings each formed on an outer peripheral portion of a corresponding one of the plurality of chips to surround the corresponding one of the plurality of chips, in which at least portions of at least two of the plurality of guard rings are connected to each other through a thermally conductive material. Further, an electric apparatus is provided that includes the semiconductor apparatus.
Claims17
A semiconductor apparatus, comprising:
- a substrate;
- a plurality of chips each stacked on the substrate;
- and
- a plurality of guard rings each formed on an outer peripheral portion of a corresponding one of the plurality of chips to surround the corresponding one of the plurality of chips, wherein
- at least portions of at least two of the plurality of guard rings are connected to each other through a thermally conductive material, and
- a nitride film is arranged between at least two of the plurality of chips that are adjacent to each other.
A semiconductor apparatus, comprising:
- a substrate;
- a plurality of chips, each stacked on the substrate, includes a first chip, a second chip, and a third chip;
- and
- a plurality of guard rings which includes a first guard ring, a second guard ring, and a third guard ring, wherein
- the first guard ring is formed on an outer peripheral portion of the first chip to surround the first chip,
- the second guard ring is formed on an outer peripheral portion of the second chip to surround the second chip,
- the third guard ring is formed on an outer peripheral portion of the third chip to surround the third chip,
- the first guard ring and the second guard ring are connected to each other through a first thermally conductive material, and
- the second guard ring and the third guard ring are connected to each other through a second thermally conductive material.
Dependencies are inferred from the claim text.