Integration of semiconductor device assemblies with thermal dissipation mechanisms
AssigneeSemiconductor Components Industries, LLC
InventorsSeungwon Im, Dongwook Kang, Oseob Jeon
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Abstract
In a general aspect, an electronic device assembly can include a semiconductor device assembly including a ceramic substrate; a patterned metal layer disposed on a first surface of the ceramic substrate; and a semiconductor die disposed on the patterned metal layer. The electronic device assembly can also include a thermal dissipation appliance. Ceramic material of a second surface of the ceramic substrate can be direct-bonded to a surface of the thermal dissipation appliance. The second surface of the ceramic substrate can be opposite the first surface of the ceramic substrate.
Claims15
An electronic device assembly comprising:
- a semiconductor device assembly including:
- a ceramic substrate;
- a patterned metal layer disposed on a first surface of the ceramic substrate;
- and
- a semiconductor die disposed on the patterned metal layer;
- and
- a water jacket having a recess, the ceramic substrate having a second surface that is direct-bonded to a plurality of cooling fins of the water jacket, the second surface of the ceramic substrate being opposite the first surface of the ceramic substrate and defining a portion of a fluidic channel of the water jacket, the plurality of cooling fins being disposed within the fluidic channel of the water jacket.
An electronic device assembly comprising:
- a first semiconductor device assembly including:
- a first ceramic substrate;
- a first patterned metal layer disposed on a first surface of the first ceramic substrate;
- and
- a first semiconductor die disposed on the first patterned metal layer;
- a second semiconductor device assembly including:
- a second ceramic substrate;
- a second patterned metal layer disposed on a first surface of the second ceramic substrate;
- and
- a second semiconductor die disposed on the second patterned metal layer;
- and
- a water jacket having at least a first recess and a second recess, the first ceramic substrate having a second surface that is direct-bonded to a plurality of cooling fins of the water jacket in the first recess and defining a portion of a fluidic channel of the water jacket, the plurality of cooling fins being disposed within the fluidic channel of the water jacket, and ceramic material of a second surface of the second ceramic substrate being direct-bonded to the water jacket in the second recess,
- the second surface of the first ceramic substrate being opposite the first surface of the first ceramic substrate, and
- the second surface of the second ceramic substrate being opposite the first surface of the second ceramic substrate.
An electronic device assembly comprising:
- a semiconductor device assembly including:
- a ceramic substrate;
- a first metal layer disposed on a first surface of the ceramic substrate;
- a second metal layer disposed on a second surface of the ceramic substrate, the second surface being opposite the first surface;
- and
- a semiconductor die coupled with the first metal layer;
- and
- a water jacket having a recess, the semiconductor device assembly being diffusion-bonded to a plurality of cooling fins disposed within a fluidic channel of the water jacket in the recess, at least one of the second metal layer or the second surface of the ceramic substrate defining a portion of a fluidic channel of the water jacket.
Dependencies are inferred from the claim text.