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US 11,961,779 B2Granted
3DIC packaging with hot spot thermal management features
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
InventorsWensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng
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Abstract
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
Claims20
A package comprising:
- a package substrate having a conductive layer and a solder resist on a same side;
- a die stack provided over the package substrate;
- a thermal interface material (TIM) directly over the conductive layer and contacting the solder resist, wherein the TIM is disposed at a same level as a top surface of the solder resist;
- and
- a heat dissipation feature disposed over the TIM.
2 more elements
A package comprising:
- a package substrate having a conductive layer and a polymer on a same side;
- a die stack over the package substrate;
- a thermal interface material (TIM) in a region directly above the conductive layer, the TIM being disposed between a first portion of the polymer and a second portion of the polymer, the first portion of the polymer and the second portion of the polymer being on opposing sides of the region;
- and
- a heat dissipation feature over the TIM, the conductive layer, and the polymer.
2 more elements
A package comprising:
- a package substrate having a conductive layer and a polymer on a same side;
- a die stack provided over the package substrate;
- a thermal interface material (TIM) directly contacting a first sidewall of the polymer and a second sidewall of the polymer;
- and
- a heat dissipation feature disposed above the TIM, wherein the conductive layer extends continuously from directly under the die stack to directly under the TIM.
2 more elements
Dependencies are inferred from the claim text.