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US 11,961,776 B2Granted
Semiconductor device with connector in package and method therefor
AssigneeNXP USA, Inc.
InventorsMichael B. Vincent, Scott M. Hayes
Life of this patent
Estimating the term…
Abstract
A method of forming a semiconductor device is provided. The method includes providing a connector structure configured for carrying a signal and providing a semiconductor die. At least a portion of the connector structure and the semiconductor die are encapsulated with an encapsulant. The semiconductor die is interconnected with the connector structure by way of a conductive trace.
Claims17
A method of manufacturing a semiconductor device, the method comprising:
- providing a connector structure configured for carrying a signal, the connector structure characterized as a coaxial connector having a signal member substantially surrounded by a conductive shield member;
- providing a semiconductor die;
- encapsulating with an encapsulant at least a portion of the connector structure and the semiconductor die;
- and
- interconnecting the semiconductor die with the connector structure by way of a conductive trace.
2 more elements
A semiconductor device comprising:
- a connector structure configured for carrying a signal, the connector structure is characterized as a coaxial connector having a signal member substantially surrounded by a conductive shield member;
- a semiconductor die having a bond pad interconnected to the connector structure by way of a conductive trace;
- and
- an encapsulant encapsulating at least a portion of the connector structure and the semiconductor die.
1 more element
A semiconductor device comprising:
- a connector structure configured for carrying a radio frequency (RF) signal, the RF signal having a frequency in an ultra-wideband (UWB) frequency range, the connector structure characterized as a coaxial connector having a signal member substantially surrounded by a conductive shield member, the signal member connected to the signal terminal;
- a semiconductor die having a bond pad interconnected to a signal terminal of the connector structure by way of a conductive trace;
- and
- an encapsulant encapsulating at least a portion of the connector structure and the semiconductor die.
1 more element
Dependencies are inferred from the claim text.