Semiconductor devices and related methods

A semiconductor device, comprising:

• a first module, comprising:
• a first substrate comprising a top side, a bottom side, a first cavity in the first substrate, and a first conductive structure;
• a first device stack comprising a first electronic device in the first cavity and a second electronic device external to the first cavity, wherein the first electronic device comprises a first device terminal and the second electronic device comprises a second device terminal;
• a first encapsulant in the first cavity;
• a second encapsulant over the top side of the first substrate, wherein the first encapsulant covers a lateral side of the first electronic device and the second encapsulant covers a lateral side of the second electronic device;
• a first internal interconnect in the first encapsulant and coupled with the first device terminal and the first conductive structure;
• and
• a second internal interconnect in the second encapsulant and coupled with the second device terminal and the first conductive structure;
• wherein a lateral side of the first encapsulant and a lateral side of the second encapsulant are flush with a lateral side of the first substrate.

A semiconductor device, comprising:

• a base substrate comprising a top side, a bottom side, and a plurality of internal base terminals;
• a first module, comprising:
• a first substrate comprising a first cavity and a first conductive structure;
• a first device stack comprising a first electronic device located in the first cavity, the first electronic device including a first device terminal;
• a first encapsulant in the first cavity and covering a lateral side of the first electronic device;
• and
• a first internal interconnect in the first encapsulant and coupled with the first conductive structure and the first device terminal;
• a second module over the first module and comprising:
• a second substrate comprising a second cavity and a second conductive structure;
• a second device stack comprising a second electronic device located in the second cavity, the second electronic device including a second device terminal;
• a second encapsulant in the second cavity and covering a lateral side of the second electronic device;
• and
• a second internal interconnect in the second encapsulant and coupled with the second conductive structure and the second device terminal;
• a main encapsulant over the base substrate;
• a first module interconnect in the main encapsulant and coupled with the first conductive structure and a first internal base terminal of the plurality of internal base terminals;
• and
• a second module interconnect in the main encapsulant and coupled with the second conductive structure and a second internal base terminal of the plurality of internal base terminals.