Automated inspection tool

A processing tool, comprising:

• a housing enclosing a processing chamber of the processing tool, wherein an input/output port is included in the housing and is configured to pass wafers into and/or out of the processing chamber within the housing;
• a gantry system including rails arranged within the processing chamber and configured to receive the wafers;
• a back-side imaging system arranged along the rails of the gantry system within the processing chamber and including a first camera, wherein the wafers are transported by the rails of the gantry system so as to pass the first camera while the wafer is at a first location along the rails within the housing such that the first camera images back sides of the wafers;
• and
• a front-side imaging system arranged along the gantry system within the processing chamber and including a second camera, wherein the wafers are transported by the gantry system so as to pass the second camera while the wafer is at a second location along the rails within the housing such that the second camera images front sides of the wafers, the second location differing from the first location within the housing.

A processing tool, comprising:

• a housing enclosing a processing chamber;
• an input/output port configured to pass a wafer from a wafer carrier through the housing into and out of the processing chamber;
• a macro-inspection system including a first camera and a second camera which are arranged along rails of a gantry system within the processing chamber, the first camera arranged along a first side of the rails and configured to image a first side of the wafer while the wafer is at a first location and the second camera arranged along a second side of the rails and configured to image a second side of the wafer while the wafer is at a second location that differs from the first location;
• and
• a micro-inspection system arranged within the processing chamber and configured to image the first side of the wafer while the wafer is at a third location that differs from the first and second locations, the first side of the wafer being opposite the second side of the wafer.