Substrate support and substrate processing apparatus

A substrate support comprising:

• a substrate support portion for supporting a substrate, having a first dielectric, and a substrate adsorption electrode and a substrate bias electrode inside the first dielectric;
• a ring support supporting an edge ring disposed to surround the substrate, and including a second dielectric, and an edge ring bias electrode inside the second dielectric;
• and a base having a central stage on which the substrate support portion is disposed, and an outer peripheral stage on which the ring support is disposed on an outer peripheral side of the central stage, wherein an upper surface of the outer peripheral stage is positioned lower than an upper surface of the central stage, and a thickness of the ring support is equal to or larger than 40% of a thickness of the substrate support portion, wherein the substrate support portion further includes a substrate heater electrode for heating the substrate, and the ring support further includes an edge ring heater electrode for heating the edge ring;
• and a first power feeding terminal disposed immediately below a lower side of the substrate support portion to supply a power to the substrate heater electrode, and a second power feeding terminal disposed immediately below a lower side of the ring support to supply the power to the edge ring heater electrode.

A substrate support comprising:

• a substrate support portion for supporting a substrate, having a first dielectric and a first electrode inside the first dielectric, the first electrode is a substrate heater electrode for heating the substrate;
• a ring support for supporting an edge ring disposed to surround the substrate and having a second dielectric and a second electrode inside the second dielectric, the second electrode is an edge ring heater electrode for heating the edge ring;
• and a base having a central stage on which the substrate support portion is disposed and an outer peripheral stage on which the ring support is disposed on an outer peripheral side of the central stage, wherein an upper surface of the outer peripheral stage is positioned lower than an upper surface of the central stage, and a thickness of the ring support is equal to or larger than 40% of a thickness of the substrate support portion;
• and a first power feeding terminal disposed immediately below a lower side of the substrate support portion to supply a power to the substrate heater electrode, and a second power feeding terminal disposed immediately below a lower side of the ring support to supply the power to the edge ring heater electrode.