Plasma processing method and plasma processing apparatus

A plasma processing apparatus comprising:

• a chamber configured to accommodate a substrate;
• an RF power supply for plasma generation;
• an upper electrode structure forming an upper portion of the chamber and including a temperature-controlled plate, an electrode plate disposed below the temperature-controlled plate,
• and an electrostatic attractor interposed between the temperature-controlled plate and the electrode plate, the electrostatic attractor including a contact surface which is in contact with a bottom surface of the temperature-controlled plate, an attraction surface configured to attract a top surface of the electrode plate, a first electrode, and a second electrode;
• a power supply configured to apply a voltage to the first electrode and the second electrode;
• a temperature obtaining portion configured to acquire a temperature distribution of the electrode plate;
• and
• a controller,
• wherein the controller is configured to execute a process including:
• acquiring, by the temperature obtaining portion, the temperature distribution of the electrode plate;
• applying a first voltage to the first electrode and applying a second voltage to the second electrode according to the acquired temperature distribution by controlling the power supply;
• and
• processing the substrate with plasma.