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US 11,961,652 B2Granted
Coil component
AssigneeTDK Corporation
InventorsHitoshi Ohkubo, Masazumi Arata, Kenichi Kawabata, Atsushi Sato
Life of this patent
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Abstract
In a coil component, a shield layer is provided after the unevenness of the surface of an element body is smoothened by the surface being covered with an insulating layer. A Cu layer of the shield layer is provided on a smooth surface, and thus a thickness variation can be suppressed and the Cu layer can be formed with a substantially uniform thickness. In the coil component, a point where the shield layer is thin or a point lacking the shield layer is unlikely to be generated and a functional degradation of the shield layer is effectively suppressed.
Claims9
A coil component comprising:
- an element body including binder powder in which metal magnetic powder is bound by binder resin and a coil embedded in the binder powder and having a pair of main surfaces facing each other in an axial direction of the coil and arising unevenness;
- an insulating layer covering one of the main surfaces and four side surfaces of the element body and smoothening the unevenness;
- a shield layer provided on the insulating layer;
- a pair of ground electrode terminals;
- and
- a pair of external electrode terminals on the other main surface of the element body,
- wherein a thickness of an end part of the shield layer is equal to that of the other end part of the shield layer,
- the element body has a rectangular parallelepiped outer shape,
- the insulating layer does not cover the other main surface of the element body,
- in a bottom plan view, each of the external electrode terminals is separated from an outer edge of the other main surface of the element body, and
- the shield layer has a multi-layer structure, and a part of each ground electrode terminal of the pair of ground electrode terminals is sandwiched between layers of the multi-layer structure of the shield layer.
8 more elements
Dependencies are inferred from the claim text.