Skew matching in a die-to-die interface

An apparatus for skew matching in a die-to-die interface, comprising:

• computer memory;
• a semiconductor package operatively coupled to the computer memory, comprising:
• a first die;
• a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is equidistant to a corresponding connection point of a second plurality of connection points of the second die, wherein a transmit block of the first die is linearly aligned with a receive block of the second die and a transmit block of the second die is linearly aligned with a receive block of the first die;
• and
• a plurality of connection paths of a same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.