Fast-axis collimator with hanging connector
AssigneeApple Inc.
InventorsAlexander Goldis, Jeffrey T. Hill, Michael J. Bishop
Life of this patent
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Abstract
A photonics package may include a substrate, a hanging connector, and a fast-axis collimator (“FAC”). The hanging connector is typically affixed to a side of the substrate other than the side through which a light output is emitted. The hanging connector may be L-shaped in cross-section, having a base section and an extended section projecting from the base section. The base section affixes to the substrate while the extended section affixes to the FAC, so that the FAC extends downward along the emitter surface of the substrate; a vertex of the FAC is coplanar with an emitter outputting the light output.
Claims14
A photonics package, comprising:
- a substrate comprising:
- a connector surface;
- and
- an emitter surface meeting the connector surface at an edge;
- a waveguide at least partially within the substrate;
- an emitter coupled to the waveguide;
- a hanging connector affixed to the connector surface;
- and
- an optical component affixed to the hanging connector;
- wherein:
- the hanging connector comprises:
- a base layer;
- a top layer;
- and
- a first layer positioned at least partially between the base layer and the top layer;
- and
- a portion of the first layer of the hanging connector forms an angled sidewall and a vertical backstop connecting the top layer of the hanging connector to the base layer of the hanging connector;
- the optical component extends along a portion of the emitter surface.
A hanging connector, comprising:
- a base section comprising:
- a base layer;
- a buried oxide layer abutting the base layer;
- and
- a silicon-on-insulator layer abutting the buried oxide layer;
- and
- an extended section connected to the base section and comprising:
- the buried oxide layer;
- and
- the base layer abutting the buried oxide layer;
- wherein:
- a portion of the buried oxide layer forms an external surface of the extended section;
- an angled sidewall and a vertical backstop connect the base section to the extended section;
- a portion of the silicon-on-insulator layer form the angled sidewall and the vertical backstop;
- the base section is configured to be affixed to a connector surface of substrate of a photonics package;
- and
- the extended section is configured to be affixed to an optical component, such that the optical component contacts the vertical backstop and a vertex of the optical component is coplanar with an emitter of the photonics package that is positioned on an emitter surface of the photonics package.
A method for forming a photonics package, comprising:
- affixing an optical component to a hanging connector with a first bond between the optical component and an oxide layer of the hanging connector;
- and
- affixing the hanging connector to a connector surface of a substrate with a second bond between a silicon-on-insulator layer of the hanging connector and the connector surface of the substrate, such that the optical component extends along an emitter surface of the substrate;
- wherein:
- a portion of the oxide layer of the hanging connector is positioned between the silicon-on-insulator layer of the hanging connector and a base layer of the hanging connector;
- a portion of the silicon-on-insulator layer of the hanging connector forms an angled sidewall and a vertical backstop connecting the oxide layer of the hanging connector to a base layer of the hanging connector;
- an emitter on the emitter surface is configured to emit a light output;
- the optical component is configured to receive the light output;
- a vertex of the optical component is coplanar with the emitter;
- and
- the optical component is configured to collimate the light output.
Dependencies are inferred from the claim text.