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US 11,959,941 B2Granted
Probe card
AssigneeIndustrial Technology Research Institute
InventorsMin-Chieh Chou, Meng-Chi Huang, Tune-Hune Kao, Yue-Zhen Huang
Life of this patent
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Abstract
A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.
Claims18
A probe card, comprising:
- a flexible inorganic material layer having a first surface and a second surface opposite to each other;
- a metal micro structure disposed on the first surface;
- and
- a circuit board disposed on the second surface, wherein the circuit board is electrically connected to the metal micro structure, and a test signal is adapted to be conducted to the circuit board through the metal micro structure;
- wherein a yield strength of the flexible inorganic material layer is greater than 500 MPa, or a Young's modulus of the flexible inorganic material layer is greater than 50 GPa,
- wherein the metal micro structure comprises a protruding portion, and the protruding portion is disposed at an end corresponding to the flexible inorganic material layer, and
- wherein the protruding portion directly contacts the metal micro structure.
4 more elements
A probe card, comprising:
- a flexible inorganic material layer having a plurality of surfaces;
- a metal micro structure disposed on at least one of the plurality of surfaces and having a connection end;
- a circuit board connected to the connection end, wherein a test signal is adapted to be conducted to the circuit board through the metal micro structure;
- and
- at least two guide plates, wherein each of the at least two guide plates has a plurality of through-holes, and the flexible inorganic material layer and the metal micro structure penetrate the plurality of through-holes of each of the at least two guide plates;
- wherein a yield strength of the flexible inorganic material layer is greater than 500 MPa, or a Young's modulus of the flexible inorganic material layer is greater than 50 GPa,
- wherein the metal micro structure comprises a protruding portion and the protruding portion is located at an end opposite to the connection end, and
- wherein the protruding portion directly contacts the metal micro structure.
5 more elements
Dependencies are inferred from the claim text.