Package substrate, apparatus for testing power supply noise and method for testing power supply noise

Abstract

A package substrate, an apparatus for testing power supply noise, and a method for testing power supply noise are provided. The package substrate includes multiple pad arrays, and each of the multiple pad arrays at least includes power supply pads. Power supply pads belonging to a same power supply type in the multiple pad arrays are divided into a test pad and a power supply pad set. The power supply pad set includes power supply pads, other than the test pad, among the power supply pads belonging to the same power supply type, all the power supply pads in the power supply pad set are electrically connected together, and the test pad is configured to perform noise testing of at least one internal power supply corresponding to the same power supply type in a chip to be tested.

Dependencies are inferred from the claim text.