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US 11,959,606 B2Granted
Package structure with supporting frame
AssigneesLite-On Opto Technology (Changzhou) Co., Ltd., Lite-On Technology Corporation
InventorsChen-Hsiu Lin, Cheng-Ying Lee, Ming-Sung Tsai
Life of this patent
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Abstract
A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.
Claims16
A package structure, comprising:
- a carrier;
- at least one photonic device disposed on the carrier;
- a supporting frame disposed on the carrier and surrounding the at least one photonic device;
- and
- an encapsulant completely covering the supporting frame and surrounding the at least one photonic device, and a top side of the at least one photonic device being exposed from the encapsulant, wherein a top side of the supporting frame is below a top surface of the encapsulant;
- and
- a first metal pad and a second metal pad disposed on the carrier, wherein the first metal pad and the second metal pad are disposed on opposite sides of the carrier, and a height ratio of the supporting frame to the second metal pad is between 2 and 4.
4 more elements
A package structure, comprising:
- a carrier;
- at least one photonic device disposed on the carrier;
- a supporting frame disposed on the carrier and surrounding the at least one photonic device;
- and
- a first metal pad and a second metal pad disposed on the carrier, the first metal pad and the second metal pad are disposed on opposite sides of the carrier, and a height ratio of the supporting frame to the second metal pad is between 2 and 4;
- wherein the supporting frame is tapered from bottom to top, and a tapered side of the supporting frame is facing away from the at least one photonic device;
- wherein a distance is defined between an outer edge of the supporting frame and the edge of the carrier.
4 more elements
A package structure, comprising:
- a carrier including a substrate and a plurality of first metal pads and second metal pads, wherein the substrate includes a first surface and a second surface that are opposite to each other, the first metal pads are disposed on the first surface, the second metal pads are disposed on the second surface, and a thickness of each of the second metal pads is greater than that of each of the first metal pads;
- at least one photonic device disposed on the carrier;
- a supporting frame disposed on the carrier, the supporting frame surrounding the at least one photonic device, an accommodating space being formed between the supporting frame and the carrier, and the at least one photonic device disposed in the accommodating space;
- a first encapsulant filled in the accommodating space;
- and
- a second encapsulant formed around an outer edge of the supporting frame;
- wherein the supporting frame is a multi-layer stacked structure;
- wherein a top side of the at least one photonic device is exposed from the first encapsulant and the second encapsulant.
5 more elements
Dependencies are inferred from the claim text.