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US 11,959,186 B2Granted
Electroplating method and electroplating apparatus
AssigneeChangxin Memory Technologies, Inc.
InventorTing Wang
Life of this patent
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Abstract
Embodiments of the present application provide an electroplating method and an electroplating apparatus. The electroplating method includes: before putting wafers into an electroplating solution to undergo an electroplating process, adding particles into the electroplating solution, and applying ultrasonic waves to the electroplating solution, so as to remove bubbles in the electroplating solution by oscillation; removing the particles in the electroplating solution; and putting the wafers into the electroplating solution to undergo the electroplating process.
Claims20
An electroplating method, comprising:
- before putting wafers into an electroplating solution to undergo an electroplating process, adding particles into the electroplating solution, and applying ultrasonic waves to the electroplating solution, so as to remove bubbles in the electroplating solution by oscillation;
- removing the particles in the electroplating solution;
- and
- putting the wafers into the electroplating solution to undergo the electroplating process.
1 more element
An electroplating apparatus, comprising:
- a reaction module configured to contain an electroplating solution, the electroplating solution being used for performing an electroplating process on wafers put in the electroplating solution;
- an ultrasonic wave module configured to apply ultrasonic waves to the electroplating solution;
- an adding module configured to add particles into the electroplating solution and put the wafers into the electroplating solution or take the wafers out of the electroplating solution;
- a processing module configured to remove the particles in the electroplating solution;
- and
- a control module configured to control operation of the ultrasonic wave module, the adding module and the processing module, wherein the control module comprises:
- a monitoring unit configured to acquire a preset duration of the ultrasonic wave module applying the ultrasonic waves and a time interval between two successive applications of the ultrasonic waves;
- a first control unit configured to control the ultrasonic wave module to apply the ultrasonic waves for the preset duration after a previous batch of wafers completes the electroplating process and is taken out of the electroplating solution;
- a second control unit configured to control the adding module to add the particles into the electroplating solution after the previous batch of wafers completes the electroplating process and is taken out of the electroplating solution;
- and
- a third control unit configured to control the processing module to remove the particles in the electroplating solution before a next batch of wafers is put into the electroplating solution to undergo the electroplating process.
8 more elements
An electroplating apparatus, comprising:
- a reaction module configured to contain an electroplating solution, the electroplating solution being used for performing an electroplating process on wafers put in the electroplating solution;
- an ultrasonic wave module configured to apply ultrasonic waves to the electroplating solution;
- an adding module configured to add particles into the electroplating solution and put the wafers into the electroplating solution or take the wafers out of the electroplating solution;
- a processing module configured to remove the particles in the electroplating solution;
- and
- a control module configured to control operation of the ultrasonic wave module, the adding module and the processing module, wherein the control module comprises:
- a detection unit configured to detect an action of putting wafers into the electroplating solution or an action of taking wafers out of the electroplating solution;
- a first regulation and control unit configured to control the ultrasonic wave module to switch on the ultrasonic waves when the action of taking wafers out of the electroplating solution is detected;
- a second regulation and control unit configured to control the adding module to add the particles into the electroplating solution when the action of taking wafers out of the electroplating solution is detected;
- and
- a third regulation and control unit configured to control the ultrasonic wave module to switch off the ultrasonic waves and the processing module to remove the particles in the electroplating solution when the action of putting wafers into the electroplating solution is detected.
8 more elements
Dependencies are inferred from the claim text.