Protection tape and manufacturing method thereof
AssigneeNan Ya Plastics Corporation
InventorsTe-Chao Liao, Chun-Che Tsao, Cheng-Hung Chen
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Abstract
A protection tape includes a base film, an antistatic layer and an adhesive layer. The antistatic layer is located on the base film. The surface impedance of the antistatic layer is less than 1E+9Ω, and the antistatic layer includes a first resin and conductive materials dispersed in the first resin. The conductive materials include at least one of metal ions and carbon. The adhesive layer is located on a corona treated surface of the base film. The protection tape provided by the present disclosure has the advantage of having resistant to corona treatment.
Claims6
A manufacturing method of a protection tape, comprising:
- providing a base film;
- forming an antistatic layer on the base film, wherein the antistatic layer comprises:
- a first resin;
- and
- conductive materials, dispersed in the first resin, wherein the conductive materials comprise at least one of metal ions and carbon, wherein forming the antistatic layer on the base film comprises:
- providing a first mixture on the base film, wherein the first mixture comprises 2 wt % to 20 wt % of the first resin, 1 wt % to 5 wt % of the conductive materials, 0.05 wt % to 10 wt % of surface modified filler particles, 0.05 wt % to 10 wt % of first additives, and 25 wt % to 85 wt % of a first solvent;
- performing a corona treatment on the base film to form a corona treated surface of the base film;
- and
- forming an adhesive layer on the corona treated surface of the base film, wherein the surface impedance of the antistatic layer after the corona treatment is less than 1E+9Ω.
Dependencies are inferred from the claim text.