Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsMasashi Koda, Yuki Kitai, Atsushi Wada, Yasunori Hoshino
Life of this patent
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Abstract
A resin composition is provided containing a polymer having a structural unit represented by the following Formula (1) in the molecule, and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less. In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
Claims19
A resin composition comprising:
- a polymer having a structural unit represented by the following Formula (1);
- and
- an inorganic filler,
- wherein the inorganic filler contains silica produced by performing a surface treatment to silica contained in a silica sol so that a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less:
- (wherein in Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon) atoms.
Dependencies are inferred from the claim text.