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US 11,958,772 B2Granted
Low-temperature fired, lead-free glass frit, paste, and vacuum glass assembly using same
AssigneeLG Electronics Inc.
InventorsWongyu Choi, Young Seok Kim
Life of this patent
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Abstract
A glass frit according to this application may include a composition of P2O5, V2O5, TeO2, CuO, ZnO, and BaO configured to replace a conventional lead glass composition and enable a low temperature calcination. A coefficient of thermal expansion (CTE) of the glass frit may be matched with that of a glass substrate. The composition may not include an inorganic filler or at least reduce a content of an inorganic filler to reduce or prevent separation and breakage and to improve durability. The glass frit may be used as a paste for a vacuum glass assembly.
Claims7
A glass frit, comprising:
- 5 to 25 weight percent (wt %) of phosphorus pentoxide (P2O5);
- 40 to 70 wt % of vanadium pentoxide (V2O5);
- 5 to 25 wt % of tellurium dioxide (TeO2);
- 1 to 5 wt % of copper oxide (CuO);
- 1 to 12 wt % of zinc oxide (ZnO);
- 1 to 5 wt % of barium oxide (BaO);
- and
- silver oxide (Ag2O),
- wherein the glass frit does not comprise an inorganic filler.
6 more elements
Dependencies are inferred from the claim text.