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US 11,958,292 B2Granted
Solvent compatible nozzle plate
AssigneeFunai Electric Co., Ltd.
InventorSean T. Weaver
Life of this patent
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Abstract
A composite photoresist material and method of making the composite photoresist material. The composite photoresist material includes: a photoresist layer devoid of a phenoxy resin, and a photoresist layer containing a phenoxy resin.
Claims13
A composite photoresist nozzle plate comprising a photoresist layer devoid of a phenoxy resin, and a photoresist layer containing a phenoxy resin wherein the photoresist layer devoid of a phenoxy resin is configured to be adjacent to a flow feature layer of a fluid ejection head.
A fluid ejection head comprising:
- a semiconductor substrate containing a plurality fluid ejection actuators on a device surface thereof and one or more fluid supply vias etched therethrough;
- a flow feature layer applied to the device surface of the semiconductor substrate, wherein the flow feature layer has fluid channels and fluid ejection chambers imaged and developed therein;
- and
- a composite photoresist nozzle plate laminated to the flow feature layer, wherein the composite photoresist nozzle plate comprises a photoresist layer devoid of a phenoxy resin adjacent to the flow feature layer, and a photoresist layer comprising a phenoxy resin adjacent to the photoresist layer devoid of a phenoxy resin.
1 more element
Dependencies are inferred from the claim text.