CMP pad construction with composite material properties using additive manufacturing processes
AssigneeApplied Materials, Inc.
InventorsRajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
Life of this patent
Estimating the term…