Polishing apparatus having surface-property measuring device of polishing pad and polishing system
AssigneeEbara Corporation
InventorsKeisuke Kamiki, Toru Maruyama, Yasuyuki Motoshima
Life of this patent
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Abstract
The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.
Claims4
A polishing system, comprising:
- a polishing apparatus including a surface-property measuring device configured to generate multiple images of multiple measurement points of a polishing pad that indicate surface properties of the polishing pad, a support arm configured to support the surface-property measuring device, and a moving unit coupled to the support arm and configured to automatically move the surface-property measuring device from a retreat position to a measure position;
- and
- a processing system in which the multiple images indicating the surface properties of the polishing pad are inputted,
- wherein the processing system includes:
- an input section in which the multiple images of the multiple measurement points are inputted;
- a storage section storing a learned model therein;
- a processing section configured to input the multiple images in the learned model to diagnose the surface properties of the polishing pad using the learned model that processes the multiple images, and determine dressing conditions, a necessity of dressing, a necessity of additional dressing, a replacement time of a dresser, and an abnormality of polishing pad, and
- the polishing apparatus is configured to dress the polishing pad based on the dressing conditions determined by the processing section.
Dependencies are inferred from the claim text.