Apparatus and method for wafer cleaning
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Abstract
The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.
Claims20
An apparatus for wafer cleaning, comprising:
- a wafer holder configured to hold a wafer;
- a cleaning nozzle configured to dispense a cleaning fluid onto a first surface of the wafer;
- and
- a cleaning brush configured to clean a second surface, opposite to the first surface, of the wafer, wherein the cleaning brush comprises:
- a plurality of bristles;
- and
- a plurality of spray outlets configured to dispense the cleaning fluid onto the second surface of the wafer, wherein the spray outlet comprises a conductive layer of carbon nanotubes.
An apparatus for wafer cleaning, comprising:
- a wafer holder configured to hold a wafer;
- a nozzle configured to dispense a cleaning fluid onto a first surface of the wafer;
- and
- a brush configured to clean a second surface of the wafer, wherein the brush comprises:
- a plurality of bristles;
- and
- a spray outlet comprising a conductive layer of carbon nanotubes disposed on an outer surface of the spray outlet and configured to dispense the cleaning fluid onto the second surface of the wafer.
An apparatus for wafer cleaning, comprising:
- a wafer holder configured to hold a wafer;
- a nozzle configured to dispense a cleaning fluid onto a first surface of the wafer;
- and
- a brush configured to clean a second surface of the wafer, wherein the brush comprises:
- a plurality of bristles,
- a pressure sensor configured to detect a pressure applied to the brush against the wafer, and
- a spray outlet configured to dispense the cleaning fluid onto the second surface of the wafer, wherein the spray outlet comprises a conductive layer of carbon nanotubes.
Dependencies are inferred from the claim text.