Deposition device and deposition method
AssigneeJapan Display Inc.
InventorsTakanobu Takenaka, Atsushi Takeda
Life of this patent
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Abstract
According to one embodiment, a deposition method includes preparing a processing substrate in which a lower electrode, a rib, and a partition including a lower portion and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate, setting a spread angle of vapor of a first material emitted from a first deposition head to a first angle, and depositing the first material on the processing substrate, and setting a spread angle of vapor of a second material emitted from a second deposition head to a second angle larger than the first angle, and depositing the second material on the processing substrate on which the first material is deposited.
Claims8
A deposition method comprising:
- preparing a processing substrate in which a lower electrode, a rib including an aperture overlapping the lower electrode, and a partition including a lower portion arranged on the rib and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate;
- setting a spread angle of vapor of a first material emitted from a first deposition head to a first angle, and depositing the first material on the processing substrate;
- and
- setting a spread angle of vapor of a second material emitted from a second deposition head to a second angle larger than the first angle, and depositing the second material on the processing substrate on which the first material is deposited, wherein
- a nozzle is surrounded by a sleeve having a first length in the first deposition head, in the depositing the first material, and
- a nozzle is surrounded by a sleeve having a second length shorter than the first length in the second deposition head, in the depositing the second material.
A deposition method comprising:
- preparing a processing substrate in which a lower electrode, a rib including an aperture overlapping the lower electrode, and a partition including a lower portion arranged on the rib and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate;
- arranging the processing substrate on a first stage, setting an angle formed between an extension direction of a nozzle of a first deposition head and a normal of the first stage to a first angle, emitting vapor of a first material from the nozzle of the first deposition head, and depositing the first material on the processing substrate;
- and
- arranging the processing substrate on which the first material is deposited, on a second stage, setting an angle formed between an extension direction of a nozzle of a second deposition head and a normal of the second stage to a second angle larger than the first angle, emitting vapor of a second material from the nozzle of the second deposition head, and depositing the second material on the processing substrate, wherein
- a nozzle is surrounded by a sleeve having a first length in the first deposition head, in the depositing the first material.
Dependencies are inferred from the claim text.