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US 11,955,505 B2Granted
Systems and methods for coaxial multi-color LED
OwnerQiming Li, Qunchao Xuinventors
Life of this patent
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Abstract
A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two more LED structures. In some embodiments, each LED structure is connected to a pixel driver and a shared P-electrode. The LED structures are bonded together through bonding layers. In some embodiments, reflection layers are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.
Claims15
A single pixel multi-color micro light-emitting diode (LED) device for a display panel, comprising:
- a substrate supporting a pixel driver;
- a first LED structure layer stacked on top of the substrate;
- a second LED structure layer stacked on top of the first LED structure layer;
- and
- a metal bonding layer between the substrate and the first LED structure layer,
- wherein the first LED structure layer and the second LED structure layer substantially overlap laterally with one another to form a light path that combines light emitted from the first LED structure layer and the second LED structure layer,
- wherein each of the first and second LED structure layers comprises:
- an epitaxial structure forming an LED;
- a lower conductive layer electrically connected to a bottom of the LED;
- and
- an upper transparent conductive layer electrically connected to a top of the LED,
- wherein:
- the lower conductive layer of the first LED structure layer and the lower conductive layer of the second LED structure layer are electrically connected to the pixel driver through a first-type electrode metal contact pad layer and the metal bonding layer, wherein the first-type electrode metal contact pad layer is in direct contact with the lower conductive layer of the first LED structure layer and the lower conductive layer of the second LED structure layer;
- the upper transparent conductive layer of the first LED structure layer is electrically connected to a first second-type electrode metal contact pad;
- and
- the upper transparent conductive layer of the second LED structure layer is electrically connected to a second second-type electrode metal contact pad.
13 more elements
A micro-LED display chip, comprising:
- a substrate supporting an array of pixel drivers;
- and
- an array of single pixel multi-color micro LED devices, each single pixel multi-color micro LED device of the array of single pixel multi-color micro LED devices being electrically connected to a corresponding pixel driver of the array of pixel drivers,
- wherein:
- each single pixel multi-color micro LED device comprises a first LED structure layer stacked on top of the substrate and the array of pixel drivers, a second LED structure layer stacked on top of the first LED structure layer, and a metal bonding layer between the substrate and the first LED structure layer;
- within each single pixel multi-color micro LED device, each of the first and second LED structure layers comprises an epitaxial structure forming an LED, a lower conductive layer electrically connected to a bottom of the LED, and an upper transparent conductive layer electrically connected to a top of the LED,
- within each single pixel multi-color micro LED device, the first LED structure layer and the second LED structure layer substantially overlap laterally with one another to form a light path that combines light emitted from the first LED structure layer and the second LED structure layer;
- within each single pixel multi-color micro LED device, the lower conductive layer of the first LED structure layer and the lower conductive layer of the second LED structure layer are electrically connected to a pixel driver corresponding to the single pixel multi-color micro LED device through an electrode metal contact pad layer and the metal bonding layer, wherein the electrode metal contact pad layer is in direct contact with the lower conductive layer of the first LED structure layer and the lower conductive layer of the second LED structure;
- upper transparent conductive layers of first LED structure layers of a plurality of single pixel multi-color micro LED devices of the array of single pixel multi-color micro LED devices are electrically connected to a first common electrode;
- and
- upper transparent conductive layers of second LED structure layers of the plurality of single pixel multi-color micro LED devices are electrically connected to a second common electrode.
8 more elements
Dependencies are inferred from the claim text.