Interconnect structure for logic circuit

A method for forming an interconnect structure comprising:

• forming a plurality of interlevel dielectric (ILD) layers over a gate layer, wherein the interconnect structure is electrically coupled to the gate layer and the gate layer includes a plurality of gate stacks extending along a first lengthwise direction;
• forming a plurality of metal routing layers in the plurality of ILD layers, wherein the plurality of metal routing layers includes a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, a fifth metal layer, a sixth metal layer, and a seventh metal layer sequentially disposed over the gate layer;
• forming a plurality of via layers in the plurality of ILD layers, wherein the plurality of via layers includes a first via layer, a second via layer, a third via layer, a fourth via layer, a fifth via layer, a sixth via layer, and a seventh via layer sequentially disposed over the gate layer;
• forming a contact layer in the plurality of ILD layers;
• and
• wherein:
• the first via layer couples the gate layer to the first metal layer, the second via layer couples the first metal layer to the second metal layer, the third via layer couples the second metal layer to the third metal layer, the fourth via layer couples the third metal layer to the fourth metal layer, the fifth via layer couples the fourth metal layer to the fifth metal layer, the sixth via layer couples the fifth metal layer to the sixth metal layer, and the seventh via layer couples the sixth metal layer to the seventh metal layer,
• the first via layer further couples the contact layer to the first metal layer,
• the first metal layer, the third metal layer, the fifth metal layer, and the seventh metal layer each extend unidirectional along a second lengthwise direction that is substantially perpendicular to the first lengthwise direction,
• the second metal layer, the fourth metal layer, and the sixth metal layer each extend unidirectional along a third lengthwise direction that is substantially parallel to the first lengthwise direction, and
• a ratio of a pitch of the gate layer (PG) to a pitch of the second metal layer (P2) to a pitch of the sixth metal layer (P6) is 3:2:4 (PG:P2:P6).

A method comprising:

• forming a gate structure extending along a first direction;
• and
• forming an interconnect structure over the gate structure, wherein the forming the interconnect structure includes:
• forming odd-numbered interconnect routing layers oriented along a second direction that is substantially perpendicular to the first direction,
• forming even-numbered interconnect routing layers oriented along a third direction that is substantially parallel to the first direction, wherein a first of the odd-numbered interconnect routing layers has a first pitch (P1), a second of the odd-numbered interconnect routing layers has a second pitch (P3), and a fourth of the odd-numbered interconnect routing layer has a third pitch (P7), and
• configuring the first pitch, the second pitch, and the third pitch, such that a ratio of the first pitch to the second pitch to the third pitch (P1:P3:P7) is 1:1:2.