Thermosensitive deformation apparatus

A thermosensitive deformation apparatus comprising:

• a high-temperature bimetal plate made of a two-layered cladding material consisting of
• a single high thermal expansion layer made of austenitic stainless steel, and
• a single low thermal expansion layer made of a thermosensitive magnetic metal having a Curie point and pressure-bonded directly to said single high thermal expansion layer, wherein a thermal expansion coefficient of the single high thermal expansion layer is higher than a thermal expansion coefficient of the single low thermal expansion layer;
• and
• a fixing member fixing an end of the high-temperature bimetal plate,
• wherein opposite end of the high-temperature bimetal plate is a free end which is not fixed,
• wherein a range of an operating temperature is over both a high temperature range of not less than said Curie point and a low temperature range of less than said Curie point, wherein an upper limit of operating temperatures in said high temperature range of not less than said Curie point is at least 500° C.,
• wherein said high-temperature bimetal plate is formed to bend resulting from a deformation by rising temperature,
• wherein a bending coefficient in said high temperature range of not less than said Curie point is smaller than a bending coefficient in said low temperature range of less than said Curie point,
• a range of said operating temperatures in said high temperature range of not less than said Curie point is larger than a range of operating temperatures in said low temperature range of less than said Curie point, and
• a thickness of said single low thermal expansion layer is larger than a thickness of said single high thermal expansion layer.