X-ray detector component, X-ray detection module, imaging device and method for manufacturing an X-ray detector component
Assigneeams International AG
InventorJens Hofrichter
Life of this patent
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Abstract
The invention relates to an X-ray detector component comprising an X-ray detector chip made from a silicon substrate and comprising charge collecting electrodes. The X-ray detector chip is suitable for providing an X-ray-dependent current at the charge collecting electrodes. The X-ray detector component further comprises a CMOS read-out circuit chip comprising connection electrodes. The X-ray detector chip and the CMOS read-out circuit chip are mechanically and electrically connected in such a manner that the charge collecting electrodes and the connection electrodes are electrically connected. The invention further relates to an X-ray detection module, an imaging device and a method for manufacturing an X-ray detector component.
Claims20
An X-ray detector component comprising:
- an X-ray detector chip made from a silicon substrate and comprising charge collecting electrodes;
- the X-ray detector chip being suitable for providing an X-ray-dependent current at the charge collecting electrodes;
- a CMOS read-out circuit chip comprising connection electrodes,
- wherein the X-ray detector chip and the CMOS read-out circuit chip are mechanically and electrically connected in such a manner that the charge collecting electrodes and the connection electrodes are electrically connected, and
- wherein the charge collecting electrodes and the connection electrodes are in direct mechanical and electrical contact.
A method for manufacturing an X-ray detector component, the method comprising:
- providing an X-ray detector silicon wafer comprising a plurality of charge collecting electrodes;
- providing a CMOS read-out circuit wafer comprising a plurality of connection electrodes;
- mechanically and electrically connecting the X-ray detector wafer and the CMOS read-out circuit wafer in such a manner that the charge collecting electrodes and the connection electrodes are electrically connected;
- separating the X-ray detector wafer and CMOS read-out circuit wafer, which are connected, into a plurality of X-ray detector components,
- wherein the charge collecting electrodes and the connection electrodes are in direct mechanical and electrical contact.
An X-ray detector component comprising:
- an X-ray detector chip made from a silicon substrate and comprising charge collecting electrodes;
- the X-ray detector chip being suitable for providing an X-ray-dependent current at the charge collecting electrodes;
- a CMOS read-out circuit chip comprising connection electrodes,
- wherein the X-ray detector chip and the CMOS read-out circuit chip are mechanically and electrically connected in such a manner that the charge collecting electrodes and the connection electrodes are electrically connected,
- wherein the charge collecting electrodes and the connection electrodes are in direct mechanical and electrical contact and wherein the X-ray detector chip is free of CdZnTe.
Dependencies are inferred from the claim text.