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US 11,953,562 B2Granted
MI sensor and method for manufacturing MI sensor
AssigneeNidec-Read Corporation
InventorTatsufumi Kusuda
Life of this patent
Estimating the term…
Abstract
An MI sensor includes: an amorphous wire; an insulator layer formed on an outer peripheral surface of the amorphous wire; and an X-axis coil, a Y-axis coil, and a Z-axis coil which are formed, in a spiral shape, on an outer peripheral surface of the insulator layer. The X-axis coil, the Y-axis coil, and the Z-axis coil are formed of a conductive layer, and the X-axis coil, the Y-axis coil, and the Z-axis coil are arranged in directions orthogonal to each other.
Claims9
An MI sensor comprising:
- a linear magnetic conductor;
- an insulator layer formed on an outer peripheral surface of the magnetic conductor;
- and
- a first coil, a second coil, and a third coil which are formed, in a spiral shape, on an outer peripheral surface of the insulator layer,
- wherein the first coil, the second coil, and the third coil are formed of a conductive layer,
- the first coil, the second coil, and the third coil are arranged in directions orthogonal to each other, and
- wherein the linear magnetic conductor is bent between the first coil and the second coil and is bent between the second coil and third coil.
4 more elements
A method for manufacturing an MI sensor comprising:
- an insulation step of forming an insulator layer on an outer peripheral surface of a linear magnetic conductor;
- a conductive layer formation step of forming a conductive layer on an outer peripheral surface of the insulator layer;
- a resist step of forming a resist layer on an outer peripheral surface of the conductive layer;
- an exposure step of exposing the resist layer with a laser to form a first groove strip, a second groove strip, and a third groove strip each having a spiral shape on an outer peripheral surface of the resist layer, form a first gap that surrounds the resist layer between the first groove strip and the second groove strip on the outer peripheral surface of the resist layer, and form a second gap that surrounds the resist layer between the second groove strip and the third groove strip on the outer peripheral surface of the resist layer;
- an etching step of performing etching using the resist layer as a masking material and removing the conductive layer in the first groove strip, the second groove strip, the third groove strip, the first gap, and the second gap to form a first coil with the conductive layer remaining around the first groove strip, form a second coil with the conductive layer remaining around the second groove strip, and form a third coil with the conductive layer remaining around the third groove strip;
- and
- a bending step of bending the magnetic conductor and the insulator layer between the first coil and the second coil and between the second coil and the third coil to arrange the first coil, the second coil, and the third coil in directions orthogonal to each other.
4 more elements
An MI sensor comprising:
- a linear magnetic conductor;
- an insulator layer formed on an outer peripheral surface of the magnetic conductor;
- and
- a first coil, a second coil, and a third coil which are formed, in a spiral shape, on an outer peripheral surface of the insulator layer,
- wherein the first coil, the second coil, and the third coil are formed of a conductive layer, and
- the first coil, the second coil, and the third coil are arranged in directions orthogonal to each other, and
- wherein both ends of the first coil, the second coil, and the third coil are formed as annular coil electrodes, each of the annular coil electrodes surrounding the insulator layer.
4 more elements
Dependencies are inferred from the claim text.