Packaging structure and method of MEMS pressure sensor
AssigneeWuxi Sencoch Semiconductor Co., Ltd.
InventorTongqing Liu
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Abstract
The present application discloses a packaging structure and method of an MEMS pressure sensor. The packaging structure of the MEMS pressure sensor includes: a film, forming a sealing chamber with a base, during manufacturing the sealing chamber is internally equipped with a sensing medium and a pressure sensor chip, when the external pressure increases, the film bends towards an inner side of the sealing chamber to cause the sealing chamber to contract and transmit pressure to the pressure sensor chip through the sensing medium. The packaging structure of the present application can avoid the sensing chip from being damaged by excessive contraction of the sealing chamber due to pressure overload, and thus achieves overload protection.
Claims10
A packaging structure of an MEMS pressure sensor, including:
- a film, forming a sealing chamber with a base, wherein the sealing chamber is internally equipped with a sensing medium and a pressure sensor chip, when the external pressure increases, the film bends towards an inner side of the sealing chamber to cause the sealing chamber to contract and transmit pressure to the pressure sensor chip through the sensing medium;
- a sealing cover, located on the base and suspended on one side of the film away from the sealing chamber, and
- a first electrode connected to the film and a second electrode connected to the sealing cover, wherein in a case that voltages access the sealing cover and the film through the corresponding electrodes, an electrostatic attraction is generated between the sealing cover and the film to balance an overloaded pressure.
Dependencies are inferred from the claim text.