Back to results
US 11,953,380 B2Granted
Combined near and mid infrared sensor in a chip scale package
AssigneeNextInput, Inc.
InventorsAli Foughi, Julius Minglin Tsai, Christopher Edwards
Life of this patent
Estimating the term…
Abstract
Described herein is a sensor in chip scale package form factor. For example, a non-vacuum packaged sensor chip described herein includes a substrate, and a sensing element arranged on the substrate. The sensing element is configured to change resistance with temperature. Additionally, the non-vacuum packaged sensor chip includes an absorbing layer configured to absorb middle infrared (“MIR”) radiation.
Claims25
A non-vacuum packaged sensor chip, comprising:
- a substrate, wherein the substrate defines a top surface and a bottom surface;
- a sensing element arranged on the substrate, wherein the sensing element is configured to change resistance with temperature;
- an absorbing layer configured to absorb middle infrared (“MIR”) radiation;
- and
- a dielectric layer arranged on the bottom surface, wherein the absorbing layer is arranged on the top surface.
2 more elements
A sensor chip, comprising:
- a substrate, wherein the substrate defines a top surface and a bottom surface;
- a sensing element arranged on the substrate, wherein the sensing element is configured to change resistance with temperature;
- an absorbing layer configured to absorb middle infrared (“MIR”) radiation;
- a dielectric layer arranged on the bottom surface, wherein the absorbing layer is arranged on the top surface;
- a plurality of terminals configured to measure a resistance of the sensing element;
- and
- a plurality of photo-current terminals configured to measure a current induced by near infrared (“NIR”) radiation.
4 more elements
Dependencies are inferred from the claim text.