Flow sensor chip

A flow sensor chip comprising:

• a substrate in which a cavity having an opening is formed;
• a membrane provided on a surface of the substrate so as to cover the opening;
• a heater provided inside the membrane;
• a first thermopile and a second thermopile provided in the membrane, the heater being interposed between the first thermopile and the second thermopile;
• a heat conduction member serving as a heat conduction path between the substrate and the membrane, wherein a first hot junction and a first cold junction of a thermocouple provided in the first thermopile and a second hot junction and a second cold junction of a thermocouple provided in the second thermopile are arranged at positions overlapping with the opening as viewed from a direction normal to the surface of the substrate;
• the heat conduction member includes:
• a first heat conduction member serving as a heat conduction path between the first cold junction and the substrate;
• and a second heat conduction member serving as a heat conduction path between the second cold junction and the substrate;
• and wherein the heat conduction member is electrically connected to a ground potential.

A flow sensor chip comprising:

• a substrate in which a cavity having an opening is formed;
• a membrane provided on a surface of the substrate so as to cover the opening;
• a heater provided inside the membrane;
• a first thermopile and a second thermopile provided in the membrane, the heater being interposed between the first thermopile and the second thermopile;
• a heat conduction member serving as a heat conduction path between the substrate and the membrane, wherein a first hot junction and a first cold junction of a thermocouple provided in the first thermopile and a second hot junction and a second cold junction of a thermocouple provided in the second thermopile are arranged at positions overlapping with the opening as viewed from a direction normal to the surface of the substrate;
• the heat conduction member includes:
• a first heat conduction member serving as a heat conduction path between the first cold junction and the substrate;
• and a second heat conduction member serving as a heat conduction path between the second cold junction and the substrate;
• and wherein the heat conduction member is constituted by a metal material containing at least one element selected from the group consisting of aluminum, titanium, copper, tungsten, molybdenum, and tantalum.