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AssigneeNidec-Read Corporation
InventorsAlexsandr Juk, Alain Ross, Takashi Miyasaka, Takeya Tsukamoto, Shigeya Kikuta
Estimating the term…
A bump inspection device images a wafer that includes a plurality of bumps arranged in parallel to each other. Each of the bumps is elongated along a first direction that is along a substrate surface. The bump inspection device includes: a laser-light source that emits laser light in a direction that is inclined relative to the substrate surface; a camera that images the substrate surface onto which the laser light is emitted; and a direction adjusting portion that adjusts an arrangement relation between the direction in which the laser light is emitted and an orientation of the wafer to allow the first direction to become inclined relative to the direction in which the laser light is emitted, in a plan view. The camera images the wafer while the first direction is inclined relative to the direction in which the laser light is emitted, in a plan view.
An imaging device for imaging a substrate that includes bumps that are on a substrate surface and are arranged at positions that correspond to points of intersection of a grid, the imaging device comprising:
An imaging method for imaging a substrate that includes bumps that are on a substrate surface and are arranged at positions that correspond to points of intersection of a grid, the imaging method comprising:
Dependencies are inferred from the claim text.