System and method of object inspection using multispectral 3D laser scanning
AssigneeMit Semiconductor (Tian Jin) Co., Ltd
InventorsKok Weng Wong, Albert Archmawety, Jun Kang Ng, Chee Chye Lee
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AssigneeMit Semiconductor (Tian Jin) Co., Ltd
InventorsKok Weng Wong, Albert Archmawety, Jun Kang Ng, Chee Chye Lee
Estimating the term…
The invention includes a system and method for obtaining high-resolution 3D images of objects. The system includes three cameras and three light sources that have different wavelengths (e.g. a red light source, a blue light source and a green light source). Each camera simultaneously captures a color image of the object. A processor separates each of the red light images, the blue light images and the green light images into separate monochrome images using each of the red light source, blue light source and green light source. The quality of the images are not subject to limited resolution of conventional RBG images. Because three different wavelengths of light are used, the surface can be accurately imaged, regardless of its characteristics (e.g. reflectivity and transparency). The system is well suited for industrial uses that require a high volume of objects, particularly those of mixed material, to be rapidly inspected for defects as small as a few microns.
A system for obtaining a high-resolution 3D image of an object, comprising:
A method of obtaining a high-resolution 3D image of an object, comprising steps of:
Dependencies are inferred from the claim text.