Semiconductor processing chambers and methods for cleaning the same

A processing chamber, comprising:

• a gas distribution member;
• a substrate support positioned below the gas distribution member, wherein the gas distribution member and the substrate support at least in part define a processing volume, and wherein the gas distribution member provides fluid access into the processing volume;
• a pumping liner disposed radially outward from the substrate support, wherein:
• the pumping liner having an outer wall and defining a first laterally extending liner portion and a first toroidally shaped liner portion;
• the pumping liner defines a plurality of apertures circumferentially disposed about the processing volume and an internal volume that is in fluid communication with the processing volume via the plurality of apertures, wherein the internal volume of the pumping liner includes a first laterally extending volume portion and a first toroidally shaped volume portion;
• and
• the pumping liner further defines a gas inlet disposed radially outward from the plurality of apertures, wherein the gas inlet provides fluid access into the internal volume of the pumping liner;
• and
• a flow control mechanism, wherein the flow control mechanism is operable to direct fluid flow into the internal volume via the gas inlet and then into the processing volume via a subset of the plurality of apertures of the pumping liner during fluid distribution into the processing volume from the gas distribution member.