Sputtering reaction chamber and process assembly of sputtering reaction chamber
AssigneeBeijing Naura Microelectronics Equipment Co., Ltd.
InventorsLiren Han, Bing Li, Keke Zhao, Lixin Pei, Guodong Bian
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AssigneeBeijing Naura Microelectronics Equipment Co., Ltd.
InventorsLiren Han, Bing Li, Keke Zhao, Lixin Pei, Guodong Bian
Estimating the term…
The present disclosure provides a sputtering reaction chamber and a process assembly of the sputtering reaction chamber. The process assembly includes a liner, and the liner includes an integrally formed body member and a cover member. The cover member may extend from a bottom of the body member to an inner side of the body member and may be configured to press an edge of a to-be-processed workpiece when a process is performed. A cooling channel may be arranged in the cover member and the body member and may be configured to cool the cover member and the body member by transferring coolant. The process assembly of the sputtering reaction chamber and the sputtering reaction chamber provided by the present disclosure can reduce heat radiation of the process assembly to the to-be-processed workpiece and released gases and impurities to effectively reduce a whisker defect and improve a product yield.
A process assembly of a sputtering reaction chamber comprising:
A sputtering reaction chamber comprising:
Dependencies are inferred from the claim text.