Resin spacer for chip stacking and packaging and preparation method thereof
AssigneeSu Zhou Dream Technology Co., Ltd.
InventorGuohong Yang
Life of this patent
Estimating the term…
Abstract
A resin spacer for chip stacking and packaging includes a fiber glass fabric used as a base material, a weight percent of the fiber glass fabric is 10-60 wt %; and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent. The resin spacer further includes a pigment. The pigment has a weight percent of 1-3 wt %, and the pigment is preferably at least one selected from white carbon black and pearl powder. The resin spacer is formed by mixing, impregnating, partially curing, stacking and pressing the resin material. The thickness of the resin spacer is 0.07-0.13 mm.
Claims15
A resin spacer for chip stacking and packaging, comprising a fiber glass fabric used as a base material, wherein
- a weight percent of the fiber glass fabric is 10-60 wt %, and the resin spacer further comprises:
- 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent, and wherein
- the glass fiber fabric has a mesh size of 100-200 mesh, the quartz powder has a mesh size of 200-400 mesh, the aluminum oxide has a mesh size of 400-600 mesh, and the calcium oxide has a mesh size of 200-400 mesh.
A method of preparing a resin spacer for chip stacking and packaging, characterized in comprising the following steps:
- S1:
- mixing:
- adding 8-40 parts by weight of epoxy resin, 10-30 parts by weight of quartz powder, 2-10 parts by weight of aluminum oxide, and 1-8 parts by weight of calcium oxide into a solvent to obtain a first mixture, stirring to dissolve the first mixture, adding 1-8 parts by weight of curing agent to obtain a second mixture, and dispersing the second mixture uniformly to obtain a resin gelatinous solution;
- S2:
- impregnating:
- impregnating 10-60 parts by weight of fiber glass fabric into the resin gelatinous solution to obtain an impregnated fabric, and controlling an impregnating amount to be 50-700 g/m2;
- S3:
- partially curing:
- drying the impregnated fabric and controlling the pre-curing degree at 30-50% to obtain a prepreg;
- S4:
- stacking and pressing:
- laminating a plurality of prepregs, then heating and pressing them simultaneously, stopping the heating after a period of heat preservation, and obtaining the resin spacer with a thickness after cooling.
Dependencies are inferred from the claim text.