Silicate glass compositions useful for the efficient production of through glass vias
AssigneeCorning Incorporated
InventorsLing Cai, Tian Huang, Yuhui Jin, Jingshi Wu
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Abstract
Disclosed herein are glass compositions that present several advantages over glasses and other materials currently used for redistribution layers for RF, interposers, and similar applications. The glasses disclosed herein are low cost, flat glasses that have high throughput for the laser damage and etching process used to create through glass vias (TGV). TGV generated using the silicate glasses and processes described herein have large waist diameters (Dw), which is a desirable feature with respect to producing glass articles such as interposers.
Claims19
A silicate glass article comprising one or more of through glass vias, wherein
- (a) the through glass via has a first surface diameter (DS1), a second surface diameter (DS2), and a waist diameter (Dw), wherein the ratio of DS1/Dw is from 1:1 to 2:1 and the ratio of DS2/Dw is from 1:1 to 2:1, and
- (b) the silicate glass comprises:
- (1) B2O3 in an amount of at least 5 mol %;
- (2) the presence of Al2O3 and RO, wherein Al2O3 is in an amount of less than 10 mol % and RO in a total amount of less than 10 mol %, wherein R is Mg, Ca, Ba, Sr, or any combination thereof, and
- (3) P2O5 in an amount of 1 mol % to 10 mol %,
- wherein the silicate glass is alkali free and does not include TiO2.
Dependencies are inferred from the claim text.