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US 11,951,739 B2Granted
Fluidic die with high aspect ratio power bond pads
AssigneeHewlett-Packard Development Company, L.P.
InventorsEric Thomas Martin, Gary G. Lutnesky, James R. Przybyla, Rogelio Cicili
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Abstract
In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a substrate and fluid actuators, the fluid actuators being disposed on the substrate. The fluidic die also includes a bond pad region defined on the substrate. The bond pad region includes a high aspect ratio power delivery bond pad with multiple bonding sites and a high aspect ratio power return bond pad with multiple bonding sites.
Claims15
A fluidic die, comprising:
- a substrate;
- fluid actuators disposed on the substrate;
- and
- a bond pad region defined on the substrate, the bond pad region comprising:
- a high aspect ratio power delivery bond pad with multiple bonding sites;
- and
- a high aspect ratio power return bond pad with multiple bonding sites.
4 more elements
A print module, comprising:
- a die carrier;
- a number of rows of fluidic die disposed on the die carrier, each fluidic die comprising:
- a substrate;
- fluid actuators disposed on the substrate to displace a fluid;
- and
- a bond pad region defined along a long edge of the substrate, the bond pad region comprising:
- a high aspect ratio power delivery bond pad with multiple bonding sites;
- and
- a high aspect ratio power return bond pad with multiple bonding sites.
6 more elements
A print module, comprising:
- an S-shaped die carrier;
- a first circuit board disposed on the S-shaped die carrier, the first circuit board to receive signals from a print device;
- an interposer circuit board disposed on top of a portion of the first circuit board, the interposer circuit board to route signals from the first circuit board to fluidic die of the print module;
- and
- a number of staggered rows of fluidic die disposed on the S-shaped die carrier, wherein:
- each fluidic die comprises:
- a substrate;
- fluid actuators disposed on the substrate to displace a fluid;
- and
- a bond pad region defined along a long edge of the substrate, the bond pad region comprising:
- a high aspect ratio power delivery bond pad with multiple bonding sites;
- and
- a high aspect ratio power return bond pad with multiple bonding sites;
- the fluidic die are disposed around edges of the interposer circuit board such that a bond pad region of each fluidic die is adjacent and connected to the interposer circuit board;
- and
- fluidic die in a second row are identical to, and rotated 180 degrees relative to, fluidic die in a first row.
13 more elements
Dependencies are inferred from the claim text.