Method of forming package structure
AssigneeIntegrated Silicon Solution, Inc.
InventorsCheng-Fu Yu, Kai-Jih Shih, Yi-Jung Liu
Life of this patent
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Abstract
A method of forming a package structure includes an etching step, a laser step, a plating step and a singulation step. In the etching step, a plurality of cutting streets of a leadframe are etched. In the laser step, a plastic package material covering on each of the cutting streets is removed via a laser beam. In the plating step, a plurality of plating surfaces are disposed on a plurality of areas of the leadframe without the plastic package material. In the singulation step, the cutting streets of the leadframe are cut to form the package structure.
Claims6
A method of forming a package structure, comprising:
- an etching step, wherein a plurality of cutting streets of a leadframe are etched;
- a laser step, wherein a plastic package material covering on each of the cutting streets is removed via a laser beam;
- a plating step, wherein a plurality of plating surfaces are disposed on a plurality of areas of the leadframe without the plastic package material;
- and
- a singulation step, wherein the cutting streets of the leadframe are cut to form the package structure;
- wherein a portion of an upper surface of each of the cutting streets of the leadframe is removed via the laser beam in the laser step.
Dependencies are inferred from the claim text.