Integrated digital force sensors and related methods of manufacture
AssigneeDecaWave, Ltd.
InventorsAli Foughi, Ryan Diestelhorst, Dan Benjamin, Julius Minglin Tsai, Michael Dueweke
Life of this patent
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Abstract
In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
Claims20
A microelectromechanical (“MEMS”) force sensor, comprising:
- a sensor die operable to receive an applied force, wherein the sensor die comprises a top surface and a bottom surface opposite thereto;
- a sensing element at the bottom surface of the sensor die, the sensing element operable to convert a strain to a signal that is proportional to the strain;
- and
- circuitry at the bottom surface of the sensor die, the circuitry operable to receive the signal from the sensing element and provide an output code based on a plurality of predetermined force thresholds.
A method for manufacturing a microelectromechanical (“MEMS”) force sensor, comprising:
- forming a sensing element at a first surface of a sensor die, the sensing element operable to convert a strain to a signal that is proportional to the strain;
- forming circuitry at the first surface of the sensor die;
- forming a trench in a second surface of the sensor die;
- and
- bonding a cap to the second surface of the sensor die to produce a sealed cavity between the cap and the sensor die, wherein:
- the sealed cavity is defined by the trench;
- and
- the sealed cavity defines a volume enclosed by the cap and the sensor die.
A microelectromechanical (“MEMS”) force sensor, comprising:
- a sensing element at a first surface of a sensor die, the sensing element operable to convert a strain to a signal that is proportional to the strain;
- circuitry at the first surface of the sensor die, the circuitry operable to receive the signal from the sensing element;
- a cap attached to a second surface of the sensor die;
- and
- a sealed cavity between the cap and the sensor die, the sealed cavity defining a volume that is enclosed by the cap and the sensor die.
Dependencies are inferred from the claim text.