Microdroplet container and method for manufacturing the same, method for spreading microdroplets, microdroplet-generating kit, temperature-controlling device, oil phase composition for microdroplet generating and method for treating the same
AssigneeSniper (Suzhou) Life Technology Co.
InventorGuang-Ji Sheng
Life of this patent
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Abstract
The present application provides a microdroplet container and a method for manufacturing the same, a method for spreading microdroplets, a microdroplet-generating kit, a temperature-controlling device, an oil phase composition for microdroplet generating and a method for treating the same. The temperature controlling device includes a flexible circuit board a heating substrate, and multiple semiconductor electric couples. The semiconductor electric couples are disposed between the flexible circuit board and a first surface of the heating substrate, and are connected to each other.
Claims17
A temperature controlling device for temperature cycling a microdroplet, comprising:
- a flexible circuit board, which is deformed during heating and cooling processes;
- a heating substrate spaced from the flexible circuit board, the heating substrate comprising a first surface and a second surface opposite to each other;
- a plurality of semiconductor electric couples disposed between the flexible circuit board and the first surface, and the plurality of semiconductor electric couples being connected to each other in series, in parallel, or in combination thereof;
- and
- a microdroplet container containing a plurality of the microdroplet, the microdroplet container being disposed on the heating substrate and away from the plurality of semiconductor electric couples;
- wherein
- each of the plurality of semiconductor electric couples comprises a P-type couple component and a N-type couple component spaced from the P-type couple component;
- the first surface comprises a plurality of first electrode plates spaced from each other, one first electrode plate corresponds to one semiconductor electric couple, the P-type couple components and the N-type couple components of the semiconductor electric couples are connected in series through the first electrode plates;
- the flexible circuit board comprises a plurality of second electrode plates spaced from each other and connected in series, two adjacent semiconductor electric couples are connected in series by one second electrode plate;
- and
- the heating substrate is configured to increase and decrease a temperature of the microdroplet container.
Dependencies are inferred from the claim text.