Resin member machining method, resin member machining apparatus, and resin component manufacturing method
AssigneesLaser Systems Inc., Nichia Corporation
InventorsYuichi Asakawa, Yasuyuki Tsuboi, Hiroaki Tamemoto, Ryota Taoka, Minoru Yamamoto
Life of this patent
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Abstract
A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.
Claims25
A method for processing a resin member, the method comprising:
- irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin, wherein the first wavelength is 375 nm or greater and 410 nm or less;
- and
- irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength, wherein a wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.
A processing apparatus for a resin member, the processing apparatus comprising:
- a first light irradiation system configured to irradiate a resin of a first member with a first light of a first wavelength that causes electronic excitation of the resin, wherein the first wavelength is 375 nm or greater and 410 nm or less;
- and
- a second light irradiation system configured to irradiate the resin of the first member with second light of a second wavelength longer than the first wavelength, wherein a wavelength range of the second wavelength is within a wavelength range in which a light absorption of the resin increases through electronic excitation of the resin.
A method for processing a resin component, the method comprising:
- irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin, wherein the first wavelength is equal to or greater than 375 nm and equal to or less than 410 nm;
- and
- irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength, wherein the second wavelength is greater than 400 nm and equal to or less than 550 nm, wherein:
- a power output of the first light is smaller than a power output of the second light.
Dependencies are inferred from the claim text.