Sound producing cell and manufacturing method thereof

A manufacturing method of a cell, comprising:

• providing a wafer comprising a first layer and a second layer;
• patterning the first layer of the wafer, so as to form at least one trench line;
• forming a latch structure;
• and
• disposing the wafer on a substrate;
• wherein the first layer comprises a membrane anchored by an anchor structure, and at least one slit is formed within and penetrates through the membrane because of the at least one trench line;
• wherein the membrane comprises a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other;
• wherein the first membrane subpart comprises a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored;
• wherein the second membrane subpart comprises a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored;
• wherein the latch structure is formed because of the at least one slit, the latch structure is configured to limit moving distances of the first membrane subpart and the second membrane subpart, and the moving distances are distances along a normal direction of a base where the cell is disposed.