Optical chips mounted on a deformed carrier
AssigneeOSRAM OLED GmbH
InventorsSiegfried Herrmann, Michael Völkl
Life of this patent
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Abstract
The invention relates to a method for producing a semiconductor component comprising a radiation-emitting optical semiconductor chip or a plurality of radiation-emitting optical semiconductor chips, said method comprising: applying the radiation-emitting optical semiconductor chip or the plurality of radiation-emitting optical semiconductor chips to a deformable flat support deforming the support; and permanently fixing the deformation.
Claims18
A method for producing a semiconductor component comprising one radiation-emitting optical semiconductor chip or a plurality of radiation-emitting optical semiconductor chips, comprising:
- applying the radiation-emitting optical semiconductor chip or the plurality of radiation-emitting optical semiconductor chips on a deformable flat carrier, wherein the deformable flat carrier has a plurality of plated through holes,
- deforming the carrier and permanently fixing the deformation, wherein the carrier is deformed by bending or curving by way of a shaping part and the bent or curved carrier is casted in order to fix the deformation,
- wherein the shaping part is removed after casting and the resultant cavity is filled or the shaping part remains in the deformed carrier after casting, and
- wherein the radiation-emitting optical semiconductor chip or the plurality of radiation-emitting optical semiconductor chips is/are arranged in an angular fashion with respect to a base side of the semiconductor component.
A semiconductor component comprising one radiation-emitting optical semiconductor chip or a plurality of radiation-emitting optical semiconductor chips on a carrier having flexible conductor tracks, which carrier has been permanently deformed after the process of applying the radiation-emitting optical semiconductor chip or the plurality of radiation-emitting optical semiconductor chips, such that the radiation-emitting optical semiconductor chip or the plurality of radiation-emitting optical semiconductor chips is/are arranged in an angular fashion with respect to a base side of the semiconductor component, wherein the carrier has a plurality of plated through holes.
Dependencies are inferred from the claim text.