Contactless communication medium and method for producing contactless communication medium
AssigneeSony Group Corporation
InventorAki Nakano
Life of this patent
Estimating the term…
Abstract
A contactless communication medium according to an embodiment of the present technology includes an IC module, a first member, a second member, and a print layer. The IC module is capable of performing a contactless communication. The first member is made of a first transparent resin material, the first member including a first surface and a second surface, the first surface being a surface in which a concave portion that accommodates therein the IC module is formed, the second surface being situated opposite to the first surface. The second member is made of a second transparent resin material, the second member being connected to the first surface or the second surface. The print layer is arranged between the first member and the second member.
Claims19
A contactless communication medium, comprising:
- an integrated circuit (IC) module used to perform a contactless communication;
- a first member that is made of a first transparent resin material, the first member including a first surface and a second surface, the first surface being a surface in which a concave portion that accommodates therein the IC module is formed, the second surface being situated opposite to the first surface;
- a second member that is made of a second transparent resin material, the second member being connected to the first surface or the second surface;
- a print layer that is arranged between the first member and the second member;
- and
- a lid member that is arranged to cover the concave portion accommodating therein the IC module.
A method for producing a contactless communication medium, the method comprising:
- forming a first member using a first transparent resin material, the first member including a first surface and a second surface, the first surface including a concave portion, the second surface being situated opposite to the first surface;
- forming a second member using a second transparent resin material;
- accommodating, in the concave portion, an integrated circuit (IC) module used to perform a contactless communication;
- connecting the second member to the first surface or the second surface of the first member such that a print layer is arranged between the first member and the second member;
- and
- arranging a lid member to cover the concave portion accommodating therein the IC module.
A method for producing a contactless communication medium, the method comprising:
- forming a first separate member using a first transparent resin material, the first separate member including a through-hole;
- forming a second separate member using the first transparent resin material;
- forming a first member by connecting the first separate member and the second separate member to cover one of openings of the through-hole, the first member including a first surface and a second surface, the first surface including a concave portion, the second surface being situated opposite to the first surface;
- forming a second member using a second transparent resin material;
- accommodating, in the concave portion, an integrated circuit (IC) module used to perform a contactless communication;
- and
- connecting the second member to the first surface or the second surface of the first member such that a print layer is arranged between the first member and the second member.
A method for producing a contactless communication medium, the method comprising:
- forming a first transparent member using a first transparent resin material, the first transparent member including a first surface and a second surface, the first surface including a plurality of concave portions, the second surface being situated opposite to the first surface;
- forming a second transparent member using a second transparent resin material;
- accommodating, in each of the plurality of concave portions, an integrated circuit (IC) module used to perform a contactless communication;
- connecting the second transparent member to the first surface or the second surface of the first transparent member such that a print layer is arranged between the first transparent member and the second transparent member;
- and
- cutting out a portion that includes each of the plurality of concave portions each accommodating therein the IC module, such that the portion has a specified shape.
A method for producing a contactless communication medium, the method comprising:
- forming a first separate member using a first transparent resin material, the first separate member including a plurality of through-holes;
- forming a second separate member using the first transparent resin material;
- forming a first transparent member by connecting the first separate member and the second separate member to cover respective openings of the plurality of through-holes that are situated on the same side, the first transparent member including a first surface and a second surface, the first surface including a plurality of concave portions, the second surface being situated opposite to the first surface;
- forming a second transparent member using a second transparent resin material;
- accommodating, in each of the plurality of concave portions, an integrated circuit (IC) module used to perform a contactless communication;
- connecting the second transparent member to the first surface or the second surface of the first transparent member such that a print layer is arranged between the first transparent member and the second transparent member;
- and
- cutting out a portion that includes each of the plurality of concave portions each accommodating therein the IC module, such that the portion has a specified shape.
Dependencies are inferred from the claim text.