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US 11,938,554 B2Granted
Electroplating of niobium titanium
AssigneeInternational Business Machines Corporation
InventorsDanielle DeGraw, Yat-Kiu-Kent Fung, James Robert Rozen
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Abstract
A structure, such as a cable assembly, is provided that has a Nb/Ti substrate and a metal layer electroplated on a portion of the Nb/Ti substrate, wherein the metal layer has a metal capable of being soldered to, such as copper, and a metal coaxial connector soldered to the metal layer.
Claims20
A structure, comprising:
- a niobium titanium substrate;
- a metal layer plated on a portion of the niobium titanium substrate;
- a coaxial connector attached to the metal layer;
- a qubit attached to the coaxial connector;
- and
- an amplifier attached to another portion of the niobium titanium substrate.
3 more elements
A cable assembly, comprising:
- a niobium titanium wire;
- a metal layer plated on a first portion of the niobium titanium wire;
- a metal coaxial connector soldered to the metal layer, wherein the metal coaxial connector comprises a microwave connector;
- a qubit attached to the metal coaxial connector;
- and
- an amplifier attached to a second portion of the niobium titanium wire.
3 more elements
A method, comprising:
- preparing a surface of a niobium titanium substrate, resulting in a prepared surface, wherein the preparing comprises:
- polishing the surface of the niobium titanium substrate using a mechanical polishing wheel, and
- sanding the surface of the niobium titanium substrate;
- and
- electroplating a metal film onto the prepared surface.
2 more elements
Dependencies are inferred from the claim text.