Polyarylate resin composition and molded article using the same
AssigneeUnitika Ltd.
InventorsToshiki Nagahata, Takatoshi Murakami
Life of this patent
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Abstract
The present invention provides a polyarylate resin composition sufficiently excellent in heat resistance, transparency, heat discoloration resistance and moist heat resistance, and a molded article made of the same. The present invention relates to a polyarylate resin composition containing 0.005˜5 parts by mass of a silane compound (C) with a boiling point of 200° C. or more, based on 100 parts by mass of the total of a polyarylate resin (A) and a polycarbonate resin (B), a content ratio of the polyarylate resin (A) and the polycarbonate resin (B) being 5/95 to 95/5 (mass ratio).
Claims6
A polyarylate resin composition;
- comprising 0.005˜5 parts by mass of a silane compound (C) with a boiling point of 200° C. or more which is represented by the following general formula (α), based on 100 parts by mass of the total of a polyarylate resin (A) and a polycarbonate resin (B), a content ratio of the polyarylate resin (A) and the polycarbonate resin (B) being 5/95 to 95/5 (mass ratio), wherein the polyarylate resin composition does not comprise a polycarbodiimide compound,
- [Chemical 1]
- [R1]n1·[R21]n2·[R22]4-n1-n2·Si (α)
- in which R1 is an aryl group;
- R21 is an alkoxy group having the number of carbon atoms 1˜10;
- R22 is a hydrogen atom or an alkyl group having the number of carbon atoms 1˜10;
- n1 is an integer of 1 to 4, n2 is an integer of 0 to 3 and the sum of n1 and n2 is an integer of 1 to 4.
Dependencies are inferred from the claim text.